Circuit World

ISSN: 0305-6120

Online from: 1974

Subject Area: Electrical & Electronic Engineering

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Volume 39 issue 2 - Latest Issue

Published: 2013, Start page: p60

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Articles
Article Id:	Article Information:
17087985	Local damage simulations of printed circuit boards based on in-plane cohesive zone parameters Peter Filipp Fuchs, Klaus Fellner, Gerald Pinter (pp. 60 - 66) Keywords: Fracture, Mechanical properties of materials, Modelling, Physical properties of materials, Printed-circuit boards, Simulation Article type: Research paper Please login \| Abstract & purchase [ HTML & PDF (428kb) ] \| Reprints & permissions
17087986	PCB base material qualifications: discrepancies between supplier recommendations, customer expectations and reality Sylvia Ehrler (pp. 67 - 74) Keywords: Customer requirements, Marketing strategy, Materials management, PCB base material, Printed-circuit boards, Process recommendation, Qualification, Suppliers Article type: Conceptual paper Please login \| Abstract & purchase [ HTML & PDF (241kb) ] \| Reprints & permissions
17087987	Challenges and developments of micro drill bit for printed circuit board: a review Hongyan Shi, Hui Li (pp. 75 - 81) Keywords: Aspect ratio, Electronic engineering, Electronic equipment and components, Environmental-friendly printed circuit boards, Flexible printed circuit board, Micro drill bit, Printed-circuit boards, Ultra small micro drill bit Article type: General review Please login \| Abstract & purchase [ HTML & PDF (318kb) ] \| Reprints & permissions
17087988	Experimental investigation of microdrilling of printed circuit board Xiaohu Zheng, Zhiqiang Liu, Qinglong An, Xibin Wang, Zongwei Xu, Ming Chen (pp. 82 - 94) Keywords: Burr, Electronic engineering, Microdrilling, Optimization, Printed-circuit boards, Thrust force Article type: Research paper Please login \| Abstract & purchase [ HTML & PDF (476kb) ] \| Reprints & permissions
17087989	Micro UHMW-PE column array molded by the utilization of PCB as mold insert Xiong Liang, Bing Li, Xiaoyu Wu, Hongyan Shi, Kun Zeng, Yatao Wang (pp. 95 - 101) Keywords: Materials with purpose, Micro-hole array PCB, Micro-molding, Mouldability, Physical properties of materials, Plasticizers, Ultra-high molecule weight polyethylene (UHMW-PE), Ultrasonic vibration Article type: Research paper Please login \| Abstract & purchase [ HTML & PDF (440kb) ] \| Reprints & permissions

New products

Article Id:	Article Information:
17087999	Mesmoproc – implementation of a maskless electrochemical surface modification process Martin Goosey, Sudipta Roy Abstract \| View HTML
17088000	The Rainbow process: I have seen it! It works! Pete Starkey Abstract \| View HTML
17088001	Polar Instruments’ Speedstack Materials Library extended to include new PCB materials from Ventec Europe Abstract \| View HTML
17088002	New JTAG support option adds boundary-scan capability to 6TL functional testers Abstract \| View HTML International diary
17088007	International diary Abstract \| View HTML Industry news
17087991	Schweizer AG announce trading figures for 2012 Abstract \| View HTML
17087992	Orbotech opens new facility in Jena, Germany Abstract \| View HTML
17087993	Ventec AS9100C approval fully certificated Abstract \| View HTML
17087994	20 percent growth in 2012 for PCB manufacturer Abstract \| View HTML
17087995	HDP User Group announces new member company Abstract \| View HTML
17087996	ERE continues advancement in imaging technology with Orbotech LDI Abstract \| View HTML Editorial
17087990	Editorial Martin Goosey Abstract \| View HTML Conferences and exhibitions
17088003	Institute of Circuit Technology Northern Seminar, Hartlepool, 6 November 2012 Pete Starkey Abstract \| View HTML
17088004	6th International Symposium on Tin Whiskers Martin Goosey Abstract \| View HTML
17088005	Large area electronics: addressing the applications challenge Martin Goosey Abstract \| View HTML
17088006	EIPC Winter Conference John Ling Abstract \| View HTML Appointments
17087997	Invotec Group Ltd appoints new sales account manager for south and south west Abstract \| View HTML
17087998	Jason Maupin promoted to Vice President, Enthone Americas Abstract \| View HTML